3M™ Boron Nitride

3M™ Boron Nitride Powder S1 functions as a filler in industrial additives, enhancing the properties of various formulations.

3M™ Boron Nitride Cooling Filler Platelets 003 E is a versatile ceramic material offering thermal conductivity, temperature stability, chemical resistance, high reflectivity, lightweighting and electrical insulation. The structure of layered hexagonal plates provides outstanding lubricating properties and is non-abrasive to tooling.

3M™ Boron Nitride Cooling Filler Platelets 006 is a versatile ceramic material offering thermal conductivity, temperature stability, chemical resistance, high reflectivity, lightweighting and electrical insulation. The structure of layered hexagonal plates provides outstanding lubricating properties and is non-abrasive to tooling.

3M™ Boron Nitride Cooling Filler Agglomerates 100 is composed of soft bulk agglomerates of crystalline BN platelets, with a mean particle size ranging from 50 to 80μm. It is ideally suited for potting resins and conformable TIM foils or pads, especially in applications with a thin bond line of 150-200μm.

3M™ Boron Nitride Cooling Filler Platelets 003 is a versatile ceramic material offering thermal conductivity, temperature stability, chemical resistance, high reflectivity, lightweighting and electrical insulation. The structure of layered hexagonal plates provides outstanding lubricating properties and is non-abrasive to tooling.

3M™ Boron Nitride Cooling Filler Platelets 009 is a engineered to improve thermal conductivity in polymers while maintaining or improving electrical insulation. Their unique properties make these additives suitable for many thermoplastic, elastomer and thermoset resins used in a wide variety of electrical and electronic applications – including thermal interface materials (TIM), consumer electronics and automotive applications.

3M™ Boron Nitride Powder S6 is a boron nitride filler with an application temperature up to 2,000°C. It has a specified active oxygen content.

3M™ Boron Nitride Cooling Filler Agglomerates 50 is a versatile ceramic material offering thermal conductivity, temperature stability, chemical resistance, high reflectivity, light weighting and electrical insulation. The structure of layered hexagonal plates provides outstanding lubricating properties and is non-abrasive to tooling.

3M™ Boron Nitride Cooling Filler Flakes 500-15 is a engineered to improve thermal conductivity in polymers while maintaining or improving electrical insulation. Their unique properties make these additives suitable for many thermoplastic, elastomer and thermoset resins used in a wide variety of electrical and electronic applications including thermal interface materials (TIM), consumer electronics and automotive applications.

3M™ Boron Nitride Cooling Filler Platelets 007HS is a versatile ceramic material offering thermal conductivity, temperature stability, chemical resistance, high reflectivity, lightweighting and electrical insulation. The structure of layered hexagonal plates provides outstanding lubricating properties and is non-abrasive to tooling.

3M™ Boron Nitride Powder SCP1 functions as an intermediate in base chemicals applications.

3M™ Boron Nitride Cooling Filler Agglomerates 50M is a versatile ceramic material offering thermal conductivity, temperature stability, chemical resistance, high reflectivity, lightweighting and electrical insulation. The structure of layered hexagonal plates provides outstanding lubricating properties and is non-abrasive to tooling.

3M™ Boron Nitride Cooling Filler Platelets 012 P is a powders of highly crystalline boron nitride single platelets. Particle mean size ranges from 0.5 to 14 μm.

3M™ Boron Nitride Cooling Filler Flakes 200-3 is a engineered to improve thermal conductivity in polymers while maintaining or improving electrical insulation. Their unique properties make these additives suitable for many thermoplastic, elastomer and thermoset resins used in a wide variety of electrical and electronic applications including thermal interface materials (TIM), consumer electronics and automotive applications.