Rilsan® BMNO TLD

Rilsan® BMNO TLD is a polyamide 11 produced from a renewable source. Rilsan® BMNO TLD is designed for injection molding.

Principal: Arkema High Performance Polymers

Polymer Name: Polyamide 11 (PA 11)

Processing Methods: Extrusion, Injection Molding, Molding

Additives Included: Release agent

Enhanced TDS

Identification & Functionality

Additives Included
Blend
Yes
Chemical Family
Country of Origin
Function
Resin
Plastics & Elastomers Functions
Polymer Name
Product Code
MITM14873
Single Ingredient
No
Technologies
Product Families

Features & Benefits

Applications & Uses

Plastics & Elastomers Processing Methods
Processing Information
  • Typical melt temperature (Min / Recommended / Max) : 210°C / 230°C / 280°C.
  • Mold temperature : 20 - 60°C
  • Drying time and temperature (only necessary for bags opened for more than two hours) : 4-6 hours at 80-90°C.

Properties

Technical Details & Test Data

Technical Data

Viscosity-shear Rate

Rilsan® BMNO TLD - Technical Graphs - 1

Shearstress-shear Rate

Rilsan® BMNO TLD - Technical Graphs - 1

Dynamic Shear Modulus-temperature

Rilsan® BMNO TLD - Technical Graphs - 1

Stress-strain

Rilsan® BMNO TLD - Technical Graphs - 1

Secant Modulus-strain

Rilsan® BMNO TLD - Technical Graphs - 1

Stress-strain (Isochronous) 120°C

Rilsan® BMNO TLD - Technical Graphs - 1

Creep Modulus-time 120°C

Rilsan® BMNO TLD - Technical Graphs - 1

 

Packaging & Availability

Packaging Type

Principal Information

Group Principal Number
S000003
Principal

Other

Color (SDS)
Translucent
Item Number
Odor (SDS)
Odorless
Other Hazards
Processing may release vapors and/or fumes which cause eye, skin and respiratory tract irritation, Prolonged or repeated exposure may cause: headache, drowsiness, nausea, weakness, (severity of effects depends on extent of exposure).
Temperature Control
No
USA/DOT UN Number
Not Applicable
Electrical Properties
ValueUnitsTest Method / Conditions
Comparative Tracking Index600.0-IEC 60112 condensed
Dielectric Constant4.0-IEC 60250 at 100 Hz, dry
Dielectric Constant3.0-IEC 60250 at 1MHz, dry
Dielectric Strength30.0kV/mmIEC 60243-1 condensed
Dissipation Factor0.0598tan δIEC 60250 100Hz, dry
Surface Resistance100000000000000.0ΩIEC 60093 condensed
Volume Resistivity1000000000000.0Ω-cmIEC 60093 condensed
Mechanical Properties
ValueUnitsTest Method / Conditions
Charpy Impact Strength9.0kJ/m²ISO 179-1EA at 23°C, condensed, notched
Charpy Impact Strength4.0kJ/m²ISO 179-1EA at -30°C, condensed, notched
Hardness68.0Shore Dcondensed
Hardness68.0Shore AISO 868 condensed
Nominal Strain at Breakmin. 50.0%ISO 527-1 condensed, at break, nominal
Nominal Strain at Breakmin. 50.0%ISO 527-2 condensed, nominal
Strain at Yield41.0%ISO 527-1 condensed
Strain at Yield41.0%ISO 527-2 condensed
Tensile Modulus1320.0MPaISO 527-1 condensed
Tensile Modulus1320.0MPaISO 527-2 condensed
Weld Load2.16kgISO 1133 at 235°C
Physical Properties
ValueUnitsTest Method / Conditions
Density1030.0kg/m³ISO 1183 condensed
Density1030.0kg/m³ISO 1183 dry basis
Humidity Absorption0.8%ISO 62 dry basis
Load/Unload Temperature145.0°CISO 75-1 at 0.45 MPa, dry, deflection under load
Load/Unload Temperature50.0°CISO 75-1 at 1.80 MPa, dry, deflection under load
Load/Unload Temperature145.0°CISO 75-2 at 0.45 MPa, dry, deflection under load
Load/Unload Temperature50.0°CISO 75-2 at 1.80 MPa, dry, deflection under load
Melt Volume-Flow Rate30.0cm³/10 minISO 1133 at 235°C
Melting Point189.0°CISO 11357-3 at 10°C/min
Melting Point189.0°CISO 11357-1 at 10°C/min
Mold Shrinkage0.9%ISO 2577 normal, dry
Mold Shrinkage0.9%ISO 2577 parallel, dry
Mold Shrinkage0.9%ISO 294-4 normal, dry
Mold Shrinkage0.9%ISO 294-4 parallel, dry
Softening Point160.0°CISO 306 at 50°C/h, 50N, dry
Water Absorption1.9%ISO 62 dry basis
SDS Physical and Chemical Properties
ValueUnitsTest Method / Conditions
Decomposition Temperature (SDS)min. 662.0°F
Lower Explosion Limit (SDS)97.0%at 85⁰C
Melting Point (SDS)175.0-190.0°C
Shelf Life & Stability
ValueUnitsTest Method / Conditions
Shelf Life2.0yr
Thermal Properties
ValueUnitsTest Method / Conditions
Coefficient of Thermal Expansion0.000085/KISO 11359-1 dry, parallel
Coefficient of Thermal Expansion0.000085/KISO 11359-2 parallel, dry