Product

D.E.R.® 661 is a standard, low molecular weight, solid epoxy resin designed for use in applications where cure must be achieved at room temperature. D.E.R.® 661 Solid Epoxy Resin can be formulated in solution to yield an excellent base for the formulation of high quality chemical resistant coatings, when cured with polyamine or polyamide curing agents. D.E.R.® 661 Solid Epoxy Resin is also widely used for glass sizing applications. D.E.R.® 661 Epoxy Resin is available in various solutions, e.g. under the designation D.E.R. 671-X75 Epoxy Resin Solution, a solution in xylene (75 wt%). The change in designation from D.E.R.® Epoxy Resin to D.E.R.® 671 Epoxy Resin in this designation reflects the slight difference in epoxy equivalent range in the solution form. D.E.R.® 661 Solid Epoxy Resin can also be used as a complimentary epoxy resin in non-epoxy coating systems to improve resistance properties.