Products

Bluesil™ MH25 A2 is straight chained polymethylhydrogensiloxane fluids.

D.E.H.® 802 is a polyamine adduct waterborne curing agent with optimized rheology specially designed to provide superior performance in roller applications. It can be used with liquid Bisphenol A and/or Bisphenol F epoxy resins. It is supplied at 50 % solids in water.

GRANOLITE® P is a pentaerythritol ester of rosin, is a light-colored and deodorized resin suitable in various adhesive and road marking Hot Melt formulations.

Diethyl toluene diamine (DETDA) is used in organic synthesis and is compatible with epoxies (EP) and polyurethanes (PU). It serves as an intermediate in base chemicals and is used in lubricants and polyurethane applications. The product functions as a chain extender, intermediate, antioxidant, and curing agent in base chemicals, industrial additives, and plastics and elastomers.

D.E.R.® 727 Epoxy Diluent is a p-tert.-butyl-phenyl glycidyl ether based reactive diluent.

D.E.H.® 445L cycloaliphatic polyamine hardener is used as curing agent for epoxy resin. It offers low tendency to yellowing when exposed to UV irradiation, low viscosity and long pot life.

CIMBAR UF is used as a filler and pigment in paints and coatings.

D.E.H.® 39 Epoxy Curing Agent is a liquid cycloaliphatic polyamine curing agent. D.E.H.® 39 Resin is a low viscosity aliphatic polyamine based on aminoethylpiperazine (AEP). D.E.H.® 39 Curing Agent provides a short pot-life and cures in minutes with liquid epoxy resins. Similar in application to D.E.H. 20, 24, 26 and 29 Epoxy Curing Agents, D.E.H.® 39 Curing Agent is used for maintenance paints, the manufacture of epoxy-amine adducts, in adhesives, civil engineering applications and as an accelerator for polyamide curing agents. In electrical applications, D.E.H.® 39 Curing Agent is used for casting, potting and encapsulation. D.E.H.® 39 Curing Agent is often used for epoxy composite materials.

D.E.H.® 502 aliphatic amine hardener is used as curing agent for epoxy resins. It provides good solvent and chemical resistance and offers good low temperature cure.

D.E.R.® 661 is a standard, low molecular weight, solid epoxy resin designed for use in applications where cure must be achieved at room temperature. D.E.R.® 661 Solid Epoxy Resin can be formulated in solution to yield an excellent base for the formulation of high quality chemical resistant coatings, when cured with polyamine or polyamide curing agents. D.E.R.® 661 Solid Epoxy Resin is also widely used for glass sizing applications. D.E.R.® 661 Epoxy Resin is available in various solutions, e.g. under the designation D.E.R. 671-X75 Epoxy Resin Solution, a solution in xylene (75 wt%). The change in designation from D.E.R.® Epoxy Resin to D.E.R.® 671 Epoxy Resin in this designation reflects the slight difference in epoxy equivalent range in the solution form. D.E.R.® 661 Solid Epoxy Resin can also be used as a complimentary epoxy resin in non-epoxy coating systems to improve resistance properties.

D.E.R.® 3401 is a low viscosity rapidly reacting bisphenol a/f epoxy resin designed for fast-curing coatings, adhesives, and mortars.

ZEOFREE® 250 is a carrier and flow promoter used as an industrial additive in ornamentals, pest control, and turf management markets.

Dynasylan® 1175 is a cationic polymeric aminofunctional silane possessing hydrolyzable inorganic methoxysilyl groups. The dual nature of its reactivity allows Dynasylan® 1175 to bind chemically to both inorganic materials (e.g. glass, metals, fillers) and organic polymers (e.g. thermosets, thermoplastics, elastomers), thus functioning as an adhesion promoter and as a surface modifier. Dynasylan® 1175 is a dark yellow to brown liquid. Dynasylan® 1175 contains 40% active ingredient and about 60% of methanol. Dynasylan® 1175 is miscible with water, with hydrolysis occurring.