- Principal:3M Advanced Materials
- Functions:Filler, Filler, Filler, Filler, Intermediate
- Chemical Name:Boron Nitride
- Chemical Family:Nitrides
- End Uses:Adhesives, Coatings, Greases, Heat Sinks, Housings, Overmolding
- Features:High Thermal Conductivity, Low Density, Low Density, Low Density
3M™ Boron Nitride Cooling Filler Platelets 001 is engineered to improve thermal conductivity in polymers while maintaining or improving electrical insulation. Their unique properties make these additives suitable for many thermoplastic, elastomer and thermoset resins used in a wide variety of electrical and electronic applications – including thermal interface materials (TIM), consumer electronics and automotive applications.