Enhanced TDS
Identification & Functionality
- Chemical Family
- Chemical Name
- Function
- Filler
- Plastics & Elastomers Functions
- Product Code
- MITM09973
- Technologies
- Product Families
Features & Benefits
- Labeling Claims
- Materials Features
- Product Features
- 3M™ Boron Nitride Cooling Filler Agglomerates CFP 001 offers a family of boron nitride cooling filler materials:
- 3M™ Boron Nitride Cooling Filler Platelets: powders of highly crystalline single platelets.
- 3M™ Boron Nitride Cooling Filler Agglomerates: soft, randomly oriented aggregated platelets.
- 3M™ Boron Nitride Cooling Filler Flakes: hard, oriented aggregated platelets.
- 3M™ Boron Nitride Cooling Filler Agglomerates CFP 001 offers a family of boron nitride cooling filler materials:
Applications & Uses
Properties
- Physical Form
- Notes
- * - Platelets CFP 003, 003E and 003SF: O ≤1.1%, Platelets CFP 001: O ≤1.2%, Agglomerates CFA 250S: O ≤10.0%.
- ** - Platelets CFP 012P: C ≤2.0%.
- *** - Platelets CFP 001 and 003SF: B₂O₃ ≤0.2%.
- **** - BN content is calculated as (100% minus B₂O₃, O, C, Si, Al, Fe, Ca, without loss on drying), Platelets CFP 001, 003, 003E and 003SF: BN ≥98.0%, Platelets CFP 012P: BN ≥97.0%, Agglomerates CFA 250S: BN ≥80.0%, contains an inorganic binder.
- ¹ - Data determined by means of SEM pictures.
Regulatory & Compliance
- Certifications & Compliance
Technical Details & Test Data
- SEM Micrograph
3M™ Boron Nitride Cooling Filler Platelets CFP 001:
Preferred for thin films <25 µm and fibers, fine channels and windings.
- Technical Data
- 3M™ Boron Nitride Cooling Filler Agglomerates CFP 001 is a versatile ceramic material offering thermal conductivity, temperature stability, chemical resistance, high reflectivity, lightweighting and electrical insulation. The structure of layered hexagonal plates provides outstanding lubricating properties and is non-abrasive to tooling.
- 3M™ Boron Nitride Cooling Filler Agglomerates CFP 001 is manufactured at fully dedicated, ISO 9001 and 14001 certified facilities.
Packaging & Availability
- Packaging Type
- Product Packaging
3M™ Boron Nitride Cooling Filler Agglomerates CFP 001 is available as 1 kg samples (maximum sample quantity 10 × 1 kg) or in a standard drum packaging of 10 kg.
Other
- Active Oxygen Content
- max. 0.7 %
- Bulk Density
- max. 0.14 g/cm³
- Bulk Density
- max. 0.14 g/cm³
- Bulk Density (SDS)
- 50.0-550.0 kg/m³
- Carbon Content
- max. 0.2 %
- Color (SDS)
- White
- Decomposition Temperature (SDS)
- 2730.0 °C
- Density (SDS)
- 2.25 g/cm³
- Item Number
- Odor (SDS)
- Odorless
- Other Hazards
- May cause thermal burns.
- Particle Size
- 0.8 µm
- Particle Size
- 0.5 µm
- Principal
- Solubility In Water (SDS)
- max. 0.162 mg/L
- Specific Surface Area
- max. 30.0 m²/g
- Chemical Properties
Value Units Test Method / Conditions Active Oxygen Content max. 0.7 % % - Physical Properties
Value Units Test Method / Conditions Bulk Density max. 0.14 g/cm³ g/cm³ ASTM B329 Bulk Density max. 0.14 g/cm³ g/cm³ ISO 3923-2 Particle Size 0.8 µm µm Laser Light Scattering Particle Size 0.5 µm µm Laser Light Scattering D(0.5) Specific Surface Area max. 30.0 m²/g m²/g - Material Composition
Value Units Test Method / Conditions Carbon Content max. 0.2 % % - SDS Physical and Chemical Properties
Value Units Test Method / Conditions Bulk Density (SDS) 50.0-550.0 kg/m³ kg/m³ Decomposition Temperature (SDS) 2730.0 °C °C Density (SDS) 2.25 g/cm³ g/cm³ at 20°C Solubility In Water (SDS) max. 0.162 mg/L mg/L