Products

D.E.R.® 664 HA functions as a binder and resin in CASE ingredients.

D.E.R.® 6155 Solid Epoxy Resin is a medium/high molecular weight solid reaction product of epichlorohydrin and bisphenol A. D.E.R.® 6155 Solid Epoxy Resin is a high molecular weight solid epoxy resin designed primarily for use in powder coating formulations which require greater flexibility. D.E.R.® 6155 Solid Epoxy Resin can be used in combination with most curing agents for epoxy powder coatings systems with good results. To achieve maximum flexibility, curing with a linear phenolic hardener such as the D.E.H.® 80 Hardeners is recommended. D.E.R.® 6155 Solid Epoxy Resin can also be used in combination with other epoxy resins to obtaining specific processing or performance properties.

D.E.R.® 667-20 is a high molecular weight "7-type" epoxy resin.

D.E.R.® 727 Epoxy Diluent is a p-tert.-butyl-phenyl glycidyl ether based reactive diluent.

D.E.H.® 445L cycloaliphatic polyamine hardener is used as curing agent for epoxy resin. It offers low tendency to yellowing when exposed to UV irradiation, low viscosity and long pot life.

D.E.H.® 39 Epoxy Curing Agent is a liquid cycloaliphatic polyamine curing agent. D.E.H.® 39 Resin is a low viscosity aliphatic polyamine based on aminoethylpiperazine (AEP). D.E.H.® 39 Curing Agent provides a short pot-life and cures in minutes with liquid epoxy resins. Similar in application to D.E.H. 20, 24, 26 and 29 Epoxy Curing Agents, D.E.H.® 39 Curing Agent is used for maintenance paints, the manufacture of epoxy-amine adducts, in adhesives, civil engineering applications and as an accelerator for polyamide curing agents. In electrical applications, D.E.H.® 39 Curing Agent is used for casting, potting and encapsulation. D.E.H.® 39 Curing Agent is often used for epoxy composite materials.

D.E.H.® 502 aliphatic amine hardener is used as curing agent for epoxy resins. It provides good solvent and chemical resistance and offers good low temperature cure.

D.E.N.® 438-MAK80 is a solution of a semi-solid reaction product of epichlorohydrin and phenol-formaldehyde novolac in methyl n-amyl ketone.

D.E.R.® 661 is a standard, low molecular weight, solid epoxy resin designed for use in applications where cure must be achieved at room temperature. D.E.R.® 661 Solid Epoxy Resin can be formulated in solution to yield an excellent base for the formulation of high quality chemical resistant coatings, when cured with polyamine or polyamide curing agents. D.E.R.® 661 Solid Epoxy Resin is also widely used for glass sizing applications. D.E.R.® 661 Epoxy Resin is available in various solutions, e.g. under the designation D.E.R. 671-X75 Epoxy Resin Solution, a solution in xylene (75 wt%). The change in designation from D.E.R.® Epoxy Resin to D.E.R.® 671 Epoxy Resin in this designation reflects the slight difference in epoxy equivalent range in the solution form. D.E.R.® 661 Solid Epoxy Resin can also be used as a complimentary epoxy resin in non-epoxy coating systems to improve resistance properties.

D.E.H.® 802 is a polyamine adduct waterborne curing agent with optimized rheology specially designed to provide superior performance in roller applications. It can be used with liquid Bisphenol A and/or Bisphenol F epoxy resins. It is supplied at 50 % solids in water.

D.E.R.® 352 liquid epoxy resin is a reaction product of epichlorohydrin with bisphenol a and Bisphenol F.

D.E.R.® 692 Solid Epoxy Resin is a low molecular weight solid reaction product of epichlorohydrin and bisphenol A.

D.E.H.® 591 specifically designed for high chemical resistance applications.