Enhanced TDS
Identification & Functionality
- Additives Included
- Blend
- Yes
- Chemical Family
- Polymer Name
- Product Code
- MITM01781
- Single Ingredient
- No
- Technologies
- Product Families
Features & Benefits
- Labeling Claims
- Materials Features
Applications & Uses
- Plastics & Elastomers End Uses
- Plastics & Elastomers Processing Methods
- Product Applications
- Athletic foot wear components
- Ski shoes
- Processing Information
- Typical melt temperature (Min / Recommended / Max) : 200°C / 240°C / 270°C.
- Typical mold temperature : 25 – 60°C.
- Drying time and temperature (only necessary for bags opened for more than two hours) : 4-6 hours at 65-75°C.
Properties
Regulatory & Compliance
- Certifications & Compliance
- Contains any chemicals listed on Prop 65 (including impurities, residues, catalysts, monomers, and by-products and excluding heavy metals)?
Technical Details & Test Data
- Technical Data
Viscosity-shear Rate
Shearstress-shear Rate
Stress-strain
Secant Modulus-strain
Stress - Strain (Isochronous) 23°C
Creep Modulus - Time 23°C
Stress - Strain (Isochronous) 60°C
Creep Modulus - Time 60°C
Stress - Strain (Isochronous) 80°C
Creep Modulus - Time 80°C
Stress - Strain (Isochronous) 100°C
Creep Modulus-Time 100°C
Specific Volume - Temperature (PVT)
Packaging & Availability
- Packaging Type
Principal Information
- Group Principal Number
- S000003
- Principal
Other
- Color (SDS)
- Colorless to slightly yellow
- Item Number
- Odor (SDS)
- Odorless
- Other Hazards
- Processing may release vapors and/or fumes which cause eye, skin and respiratory tract irritation, The product, in the form supplied, is not anticipated to produce significant adverse human health effects. Contains high molecular weight polymer(s). Effects due to processing releases: Irritating to eyes, respiratory system and skin, Prolonged or repeated exposure may cause: headache, drowsiness, nausea, weakness, (severity of effects depends on extent of exposure).
- USA/DOT UN Number
- Not Applicable
- Thermal Properties
Value Units Test Method / Conditions Coefficient of Thermal Expansion 0.00017 /K /K ISO 11359-1 parallel, dry Specific Heat 2800.0 J/kg.K J/kg.K dry, of melt Thermal Conductivity 0.18 W/m·K W/m·K - Shelf Life & Stability
Value Units Test Method / Conditions Shelf Life 2.0 yr yr - Electrical Properties
Value Units Test Method / Conditions Comparative Tracking Index 600.0 - IEC 60112 condensed Dielectric Constant 9.0 - IEC 60250 at 100 Hz, dry Dielectric Constant 5.0 - IEC 60250 at 1MHz, dry Dielectric Strength 38.5 kV/mm kV/mm IEC 60243-1 dry basis Dissipation Factor 0.111 tan δ tan δ IEC 60250 100Hz, dry Dissipation Factor 0.102 tan δ tan δ IEC 60250 1MHz, dry Surface Resistance 3000000000000.0 Ω Ω IEC 60093 condensed Volume Resistivity 320000000000.0 Ω-cm Ω-cm IEC 60093 dry basis - Mechanical Properties
Value Units Test Method / Conditions Hardness 50.0 Shore A Shore A ISO 868 Nominal Strain at Break min. 50.0 % % ISO 527-1 dry, at break, nominal Nominal Strain at Break min. 50.0 % % ISO 527-2 condensed, at break, nominal Strain at Yield 25.0 % % ISO 527-1 dry basis Strain at Yield 25.0 % % ISO 527-2 condensed Strain at Yield 25.0 % % ISO 527-2 dry basis Stress at Yield 12.0 MPa MPa ISO 527-1 dry, at yield Stress at Yield 12.0 MPa MPa ISO 527-2 condensed, at yield Tensile Modulus 170.0 MPa MPa ISO 527-1 dry basis Tensile Modulus 165.0 MPa MPa ISO 527-2 condensed - Physical Properties
Value Units Test Method / Conditions Density 830.0 kg/m³ kg/m³ dry, liquid Density 1010.0 kg/m³ kg/m³ ISO 1183 condensed Density 1010.0 kg/m³ kg/m³ ISO 1183 dry basis Humidity Absorption 0.6 % % ISO 62 dry basis Load/Unload Temperature 66.0 °C °C ISO 75-1 at 0.45 MPa, dry, deflection under load Melting Point 159.0 °C °C ISO 11357-1 at 10°C/min Mold Shrinkage 1.4 % % ISO 2577 normal, dry Mold Shrinkage 1.2 % % ISO 2577 parallel, dry Mold Shrinkage 1.4 % % ISO 294-4 normal, dry Mold Shrinkage 1.2 % % ISO 294-4 parallel, dry Softening Point 142.0 °C °C ISO 306 at 50°C/h, 50N, dry Water Absorption 1.2 % % ISO 62 dry basis - SDS Physical and Chemical Properties
Value Units Test Method / Conditions Decomposition Temperature (SDS) 572.0-662.0 °F °F