Rilsan® BESNO P40

Rilsan® BESNO P40 TL is a polyamide 11 produced from a renewable source. Rilsan® BESNO P40 is plasticized and designed for extrusion.

Principal: Arkema High Performance Polymers

Processing Methods: Extrusion, Molding

Enhanced TDS

Identification & Functionality

Blend
No
Chemical Family
Country of Origin
Function
Resin
Plastics & Elastomers Functions
Product Code
MITM14912
Single Ingredient
Yes
Technologies
Product Families

Features & Benefits

Applications & Uses

Plastics & Elastomers End Uses
Plastics & Elastomers Processing Methods
Processing Information
  • Typical melt temperature (Min / Recommended / Max) : 230℃/250℃ / 280℃.
  • Drying time and temperature (only necessary for bags opened for more than two hours) : 4-8 hours at 80-90℃.

Properties

Physical Form

Technical Details & Test Data

Modulus Data

Rilsan® BESNO P40 - Creep Modulus-time 100°c - 1

Modulus Data

Rilsan® BESNO P40 - Dynamic Shear Modulus - Temperature - 1

Technical Data

Rilsan® BESNO P40 - Stress - Strain - 1

Modulus Data

Rilsan® BESNO P40 - Creep Modulus-time 23°c - 1

Technical Data

Rilsan® BESNO P40 - Stress - Strain (Isochronous) at 100°c - 1

Technical Data

Rilsan® BESNO P40 - Stress - Strain (Isochronous) at 23°c - 1

Technical Data

Rilsan® BESNO P40 - Viscosity-Shear Rate - 1

Technical Data

Rilsan® BESNO P40 - Secant Modulus - Strain - 1

Technical Data

Rilsan® BESNO P40 - Shear Stress-Shear Rate - 1

Technical Data

Rilsan® BESNO P40 - Specific Volume - Temperature(PVT) - 1

Packaging & Availability

Packaging Type

Principal Information

Group Principal Number
S000003
Principal

Other

Color (SDS)
Black
Item Number
Odor (SDS)
Odorless
Other Hazards
Processing may release vapors and/or fumes which cause eye, skin and respiratory tract irritation, Prolonged or repeated exposure may cause: headache, drowsiness, nausea, weakness, (severity of effects depends on extent of exposure).
Temperature Control
No
USA/DOT UN Number
Not Applicable
Electrical Properties
ValueUnitsTest Method / Conditions
Dielectric Constant9.0-IEC 60250 at 100 Hz, dry
Dielectric Constant4.0-IEC 60250 at 1MHz, dry
Dielectric Strength23.0kV/mmIEC 60243-1 condensed
Dissipation Factor0.244tan δIEC 60250 at 100 Hz, dry
Dissipation Factor0.104tan δIEC 60250 at 1MHz, dry
Surface Resistance500000000000.0ΩIEC 60093 condensed
Volume Resistivity1000000000.0Ω-cmIEC 60093 condensed
Material Composition
ValueUnitsTest Method / Conditions
Carbon Contentmin. 89.0%ASTM D6866
Mechanical Properties
ValueUnitsTest Method / Conditions
Charpy Impact Strength7.0kJ/m²ISO 179-1EA at -30°C, condensed, notched
Hardness60.0Shore D
Nominal Strain at Breakmin. 50.0%ISO 527-1 condensed, at break, nominal
Nominal Strain at Breakmin. 50.0%ISO 527-2 condensed, nominal
Puncture Energy70.0JISO 6603 at -30°C, condensed
Puncture Force6000.0NISO 6603 at -30°C
Strain at Yield50.0%ISO 527-1 condensed
Strain at Yield50.0%ISO 527-2 condensed
Tensile Modulus345.0MPaISO 527-1 condensed
Tensile Modulus345.0MPaISO 527-2 condensed
Physical Properties
ValueUnitsTest Method / Conditions
Density1040.0kg/m³ISO 1183 condensed
Density1040.0kg/m³ISO 1183 dry basis
Load/Unload Temperature130.0°CISO 75-1 at 0.45 MPa, dry, deflection under load
Load/Unload Temperature45.0°CISO 75-1 at 1.80 MPa, dry, deflection under load
Load/Unload Temperature130.0°CISO 75-2 at 0.45 MPa, dry, deflection under load
Load/Unload Temperature45.0°CISO 75-2 at 1.80 MPa, dry, deflection under load
Melting Point181.0°CISO 11357-3 at 10°C/min
Melting Point181.0°CISO 11357-1 at 10°C/min
Softening Point140.0°CISO 306 at 50°C/h, 50N, dry
Water Absorption1.6%ISO 62 dry basis
SDS Physical and Chemical Properties
ValueUnitsTest Method / Conditions
Decomposition Temperature (SDS)350.0°C
Lower Explosion Limit (SDS)89.0%at 85⁰C
Melting Point (SDS)175.0-190.0°C
Shelf Life & Stability
ValueUnitsTest Method / Conditions
Shelf Life24.0mo
Thermal Properties
ValueUnitsTest Method / Conditions
Coefficient of Thermal Expansion0.00011/KISO 11359-1 dry, parallel
Coefficient of Thermal Expansion0.00011/KISO 11359-2 parallel, dry