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Palmer Holland, Inc.

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Fillers & Extenders

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Processing Aids

Catalysts, Initiators & Crosslinkers

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49 Products found on Palmer Holland, Inc. in Elastomer Additives

3M™ Boron Nitride Cooling Filler Flakes 500-3 banner

Palmer Holland, Inc.3M™ Boron Nitride Cooling Filler Flakes 500-3

Principal:3M Advanced Materials
Functions:Filler, Filler, Filler, Intermediate
Chemical Name:Boron Nitride
Chemical Family:Boron-based Compounds, Nitrides
End Uses:Electrical Insulation, Greases, Housings
Processing Methods:Injection Molding
Labeling Claims:Odor-free, Persistent Organic Pollutants (POP)-free

3M™ Boron Nitride Cooling Filler Flakes 500-3 is a versatile ceramic material offering thermal conductivity, temperature stability, chemical resistance, high reflectivity, lightweighting and electrical insulation. The structure of layered hexagonal plates provides outstanding lubricating properties and is non-abrasive to tooling

Palmer Holland, Inc.XIBOND® 245

Principal:Aurorium - Plastics
Functions:Compatibilizer, Coupling Agent, Surface Modifier, Viscosity Modifier
Processing Methods:Extrusion
Chemical Family:Styrene-Maleic Anhydride (SMA)
Labeling Claims:Allergen-free, Animal Products-free, Asbestos-free, Azo Colorants-free, Azo Dyes-free, Bisphenol A-free, Bisphenol B-free, Bisphenol F-free, Bisphenol S-free, Bisphenol Z-free, Bisphenols-free, Butyl Benzyl Phthalate (BBP)-free, Cadmium-free, Chlorophenol-free, Conflict Minerals-free, DEHP (Diethylhexylphthalate) Free, Decabromodiphenyl ether (decaBDE)-free, Dibutyl Phthalate (DBP)-free, Diisobutyl Phthalate (DIBP)-free, Dimethylfumarate-free, Epoxy Derivatives-free, Formaldehyde-free, Halal Suitable, Halogen-free, Heavy Metal-free, Hexavalent Chromium-free, Kosher Suitable, Latex-free, Lead-free, Mercury-free, Nanomaterials-free, Octabromodiphenyl Ether (OctaBDE)-free, Ozone Non Depleting, Pentachlorophenol-free, Per & Polyfluoroalkyl Substances (PFAS)-free, Perfluorohexane sulfonate (PFHxS)-free, Perfluorooctane Sulfonate (PFOS)-free, Perfluorooctanoic Acid (PFOA)-free, Persistent Organic Pollutants (POP)-free, Polybrominated Biphenyls (PBB)-free, Polybrominated Diphenyl Ethers (PBDEs)-free, Polycyclic Aromatic Hydrocarbons (PAH)-free, Silicone-free

XIBOND® 245 is a reactive additive to improve the blend morphology of polymer blends. This additive is a random copolymer of styrene and maleic anhydride.

Palmer Holland, Inc.XIBOND® 285

Principal:Aurorium - Plastics
Functions:Compatibilizer, Coupling Agent, Surface Modifier, Viscosity Modifier
Processing Methods:Extrusion
Chemical Family:Styrene-Maleic Anhydride (SMA)
Labeling Claims:Allergen-free, Animal Products-free, Asbestos-free, Azo Colorants-free, Azo Dyes-free, Bisphenol A-free, Bisphenol B-free, Bisphenol F-free, Bisphenol S-free, Bisphenol Z-free, Bisphenols-free, Butyl Benzyl Phthalate (BBP)-free, Cadmium-free, Chlorophenol-free, Conflict Minerals-free, DEHP (Diethylhexylphthalate) Free, Decabromodiphenyl ether (decaBDE)-free, Dibutyl Phthalate (DBP)-free, Diisobutyl Phthalate (DIBP)-free, Dimethylfumarate-free, Epoxy Derivatives-free, Formaldehyde-free, Halal Suitable, Halogen-free, Heavy Metal-free, Hexavalent Chromium-free, Kosher Suitable, Latex-free, Lead-free, Mercury-free, Nanomaterials-free, Octabromodiphenyl Ether (OctaBDE)-free, Ozone Non Depleting, Pentachlorophenol-free, Per & Polyfluoroalkyl Substances (PFAS)-free, Perfluorohexane sulfonate (PFHxS)-free, Perfluorooctane Sulfonate (PFOS)-free, Perfluorooctanoic Acid (PFOA)-free, Persistent Organic Pollutants (POP)-free, Polybrominated Biphenyls (PBB)-free, Polybrominated Diphenyl Ethers (PBDEs)-free, Polycyclic Aromatic Hydrocarbons (PAH)-free, Silicone-free

XIBOND® 285 is a reactive additive to improve the blend morphology of polymer blends. This additive is a random copolymer of styrene and maleic anhydride.

3M™ Boron Nitride Cooling Filler Platelets 007HS banner

Palmer Holland, Inc.3M™ Boron Nitride Cooling Filler Platelets 007HS

Principal:3M Advanced Materials
Functions:Filler, Filler, Filler, Filler, Intermediate
Chemical Name:Boron Nitride
Chemical Family:Nitrides
End Uses:Electrical Insulation, Greases, Heat Sinks, Housings, Injection Molded Parts, Overmolding
Processing Methods:Injection Molding
Features:Low Density, Low Density

3M™ Boron Nitride Cooling Filler Platelets 007HS is a versatile ceramic material offering thermal conductivity, temperature stability, chemical resistance, high reflectivity, lightweighting and electrical insulation. The structure of layered hexagonal plates provides outstanding lubricating properties and is non-abrasive to tooling.

Palmer Holland, Inc.XIBOND® 120

Principal:Aurorium - Plastics
Functions:Compatibilizer, Coupling Agent, Surface Modifier, Viscosity Modifier
Processing Methods:Extrusion
Chemical Family:Styrene-Maleic Anhydride (SMA)
Labeling Claims:Allergen-free, Animal Products-free, Asbestos-free, Azo Colorants-free, Azo Dyes-free, Bisphenol A-free, Bisphenol B-free, Bisphenol F-free, Bisphenol S-free, Bisphenol Z-free, Bisphenols-free, Butyl Benzyl Phthalate (BBP)-free, Cadmium-free, Chlorophenol-free, Conflict Minerals-free, DEHP (Diethylhexylphthalate) Free, Decabromodiphenyl ether (decaBDE)-free, Dibutyl Phthalate (DBP)-free, Diisobutyl Phthalate (DIBP)-free, Dimethylfumarate-free, Epoxy Derivatives-free, Formaldehyde-free, Halal Suitable, Halogen-free, Heavy Metal-free, Hexavalent Chromium-free, Kosher Suitable, Latex-free, Lead-free, Mercury-free, Nanomaterials-free, Octabromodiphenyl Ether (OctaBDE)-free, Ozone Non Depleting, Pentachlorophenol-free, Per & Polyfluoroalkyl Substances (PFAS)-free, Perfluorohexane sulfonate (PFHxS)-free, Perfluorooctane Sulfonate (PFOS)-free, Perfluorooctanoic Acid (PFOA)-free, Persistent Organic Pollutants (POP)-free, Polybrominated Biphenyls (PBB)-free, Polybrominated Diphenyl Ethers (PBDEs)-free, Polycyclic Aromatic Hydrocarbons (PAH)-free, Silicone-free

XIBOND® 120 is a reactive additive to improve the blend morphology of polymer blends. This additive is a random copolymer of styrene and maleic anhydride.

Palmer Holland, Inc.XIBOND® 375

Principal:Aurorium - Plastics
Functions:Compatibilizer, Coupling Agent, Surface Modifier, Viscosity Modifier
Processing Methods:Extrusion
Chemical Family:Styrene-Maleic Anhydride (SMA)
Labeling Claims:Allergen-free, Animal Products-free, Asbestos-free, Azo Colorants-free, Azo Dyes-free, Bisphenol A-free, Bisphenol B-free, Bisphenol F-free, Bisphenol S-free, Bisphenol Z-free, Bisphenols-free, Butyl Benzyl Phthalate (BBP)-free, Cadmium-free, Chlorophenol-free, Conflict Minerals-free, DEHP (Diethylhexylphthalate) Free, Decabromodiphenyl ether (decaBDE)-free, Dibutyl Phthalate (DBP)-free, Diisobutyl Phthalate (DIBP)-free, Dimethylfumarate-free, Epoxy Derivatives-free, Formaldehyde-free, Halal Suitable, Halogen-free, Heavy Metal-free, Hexavalent Chromium-free, Kosher Suitable, Latex-free, Lead-free, Mercury-free, Nanomaterials-free, Octabromodiphenyl Ether (OctaBDE)-free, Ozone Non Depleting, Pentachlorophenol-free, Per & Polyfluoroalkyl Substances (PFAS)-free, Perfluorohexane sulfonate (PFHxS)-free, Perfluorooctane Sulfonate (PFOS)-free, Perfluorooctanoic Acid (PFOA)-free, Persistent Organic Pollutants (POP)-free, Polybrominated Biphenyls (PBB)-free, Polybrominated Diphenyl Ethers (PBDEs)-free, Polycyclic Aromatic Hydrocarbons (PAH)-free, Silicone-free

XIBOND® 375 is a reactive additive to improve the blend morphology of polymer blends; this additive is a random terpolymer of styrene, maleic anhydride and N-Phenylmaleimide.

3M™ Boron Nitride Cooling Filler Agglomerates 250S banner

Palmer Holland, Inc.3M™ Boron Nitride Cooling Filler Agglomerates 250S

Principal:3M Advanced Materials
Functions:Filler, Filler, Filler, Intermediate
Chemical Name:Boron Nitride
Chemical Family:Nitrides
End Uses:Electrical Insulation, Thermal Interface Materials

3M™ Boron Nitride Cooling Filler Agglomerates 250S is a versatile ceramic material offering thermal conductivity, temperature stability, chemical resistance, high reflectivity, lightweighting and electrical insulation. The structure of layered hexagonal plates provides outstanding lubricating properties and is non-abrasive to tooling.

Palmer Holland, Inc.XIBOND® 260

Principal:Aurorium - Plastics
Functions:Compatibilizer, Coupling Agent, Surface Modifier, Viscosity Modifier
Processing Methods:Extrusion
Chemical Family:Styrene-Maleic Anhydride (SMA)
Labeling Claims:Allergen-free, Animal Products-free, Asbestos-free, Azo Colorants-free, Azo Dyes-free, Bisphenol A-free, Bisphenol B-free, Bisphenol F-free, Bisphenol S-free, Bisphenol Z-free, Bisphenols-free, Butyl Benzyl Phthalate (BBP)-free, Cadmium-free, Chlorophenol-free, Conflict Minerals-free, DEHP (Diethylhexylphthalate) Free, Decabromodiphenyl ether (decaBDE)-free, Dibutyl Phthalate (DBP)-free, Diisobutyl Phthalate (DIBP)-free, Dimethylfumarate-free, Epoxy Derivatives-free, Formaldehyde-free, Halal Suitable, Halogen-free, Heavy Metal-free, Hexavalent Chromium-free, Kosher Suitable, Latex-free, Lead-free, Mercury-free, Nanomaterials-free, Octabromodiphenyl Ether (OctaBDE)-free, Ozone Non Depleting, Pentachlorophenol-free, Per & Polyfluoroalkyl Substances (PFAS)-free, Perfluorohexane sulfonate (PFHxS)-free, Perfluorooctane Sulfonate (PFOS)-free, Perfluorooctanoic Acid (PFOA)-free, Persistent Organic Pollutants (POP)-free, Polybrominated Biphenyls (PBB)-free, Polybrominated Diphenyl Ethers (PBDEs)-free, Polycyclic Aromatic Hydrocarbons (PAH)-free, Silicone-free

XIBOND® 260 is a reactive additive to improve the blend morphology of polymer blends. This additive is a random copolymer of styrene and maleic anhydride.

3M™ Boron Nitride Cooling Filler Flakes 200-15 banner

Palmer Holland, Inc.3M™ Boron Nitride Cooling Filler Flakes 200-15

Principal:3M Advanced Materials
Functions:Filler, Filler, Filler, Intermediate
Chemical Name:Boron Nitride
Chemical Family:Nitrides
End Uses:Electrical Insulation, Greases, Housings
Labeling Claims:Persistent Organic Pollutants (POP)-free
Features:Good Thermal Conductivity, High Thermal Conductivity

3M™ Boron Nitride Cooling Filler Flakes 200-15 is a versatile ceramic material offering thermal conductivity, temperature stability, chemical resistance, high reflectivity, lightweighting and electrical insulation. The structure of layered hexagonal plates provides outstanding lubricating properties and is non-abrasive to tooling.

Palmer Holland, Inc.XIBOND® 165

Principal:Aurorium - Plastics
Functions:Compatibilizer, Coupling Agent, Surface Modifier, Viscosity Modifier
Processing Methods:Extrusion
Chemical Family:Styrene-Maleic Anhydride (SMA)
Labeling Claims:Allergen-free, Animal Products-free, Asbestos-free, Azo Colorants-free, Azo Dyes-free, Bisphenol A-free, Bisphenol B-free, Bisphenol F-free, Bisphenol S-free, Bisphenol Z-free, Bisphenols-free, Butyl Benzyl Phthalate (BBP)-free, Cadmium-free, Chlorophenol-free, Conflict Minerals-free, DEHP (Diethylhexylphthalate) Free, Decabromodiphenyl ether (decaBDE)-free, Dibutyl Phthalate (DBP)-free, Diisobutyl Phthalate (DIBP)-free, Dimethylfumarate-free, Epoxy Derivatives-free, Formaldehyde-free, Halal Suitable, Halogen-free, Heavy Metal-free, Hexavalent Chromium-free, Kosher Suitable, Latex-free, Lead-free, Mercury-free, Nanomaterials-free, Octabromodiphenyl Ether (OctaBDE)-free, Ozone Non Depleting, Pentachlorophenol-free, Per & Polyfluoroalkyl Substances (PFAS)-free, Perfluorohexane sulfonate (PFHxS)-free, Perfluorooctane Sulfonate (PFOS)-free, Perfluorooctanoic Acid (PFOA)-free, Persistent Organic Pollutants (POP)-free, Polybrominated Biphenyls (PBB)-free, Polybrominated Diphenyl Ethers (PBDEs)-free, Polycyclic Aromatic Hydrocarbons (PAH)-free, Silicone-free

XIBOND® 165 is a reactive additive to improve the blend morphology of polymer blends. This additive is a random copolymer of styrene and maleic anhydride.

Palmer Holland, Inc.XIBOND® 265

Principal:Aurorium - Plastics
Functions:Compatibilizer, Coupling Agent, Surface Modifier, Viscosity Modifier
Processing Methods:Extrusion
Chemical Family:Styrene-Maleic Anhydride (SMA)
Labeling Claims:Allergen-free, Animal Products-free, Asbestos-free, Azo Colorants-free, Azo Dyes-free, Bisphenol A-free, Bisphenol B-free, Bisphenol F-free, Bisphenol S-free, Bisphenol Z-free, Bisphenols-free, Butyl Benzyl Phthalate (BBP)-free, Cadmium-free, Chlorophenol-free, Conflict Minerals-free, DEHP (Diethylhexylphthalate) Free, Decabromodiphenyl ether (decaBDE)-free, Dibutyl Phthalate (DBP)-free, Diisobutyl Phthalate (DIBP)-free, Dimethylfumarate-free, Epoxy Derivatives-free, Formaldehyde-free, Halal Suitable, Halogen-free, Heavy Metal-free, Hexavalent Chromium-free, Kosher Suitable, Latex-free, Lead-free, Mercury-free, Nanomaterials-free, Octabromodiphenyl Ether (OctaBDE)-free, Ozone Non Depleting, Pentachlorophenol-free, Per & Polyfluoroalkyl Substances (PFAS)-free, Perfluorohexane sulfonate (PFHxS)-free, Perfluorooctane Sulfonate (PFOS)-free, Perfluorooctanoic Acid (PFOA)-free, Persistent Organic Pollutants (POP)-free, Polybrominated Biphenyls (PBB)-free, Polybrominated Diphenyl Ethers (PBDEs)-free, Polycyclic Aromatic Hydrocarbons (PAH)-free, Silicone-free

XIBOND® 265 is a reactive additive to improve the blend morphology of polymer blends. This additive is a random copolymer of styrene and maleic anhydride.

3M™ Boron Nitride Cooling Filler Platelets 003SF banner

Palmer Holland, Inc.3M™ Boron Nitride Cooling Filler Platelets 003SF

Principal:3M Advanced Materials
Functions:Filler, Filler, Filler, Filler, Filler, Intermediate
Chemical Name:Boron Nitride
Chemical Family:Nitrides
End Uses:Electrical Insulation, Fibers, Film, Greases, Heat Sinks, Housings, Overmolding
Features:Low Density, Low Density, Low Density

3M™ Boron Nitride Cooling Filler Platelets 003 SF is a versatile ceramic material offering thermal conductivity, temperature stability, chemical resistance, high reflectivity, lightweighting and electrical insulation. The structure of layered hexagonal plates provides outstanding lubricating properties and is non-abrasive to tooling.

3M™ Boron Nitride Cooling Filler Platelets 009 banner

Palmer Holland, Inc.3M™ Boron Nitride Cooling Filler Platelets 009

Principal:3M Advanced Materials
Functions:Filler, Filler, Filler, Filler, Filler, Intermediate
Chemical Name:Boron Nitride
Chemical Family:Nitrides
End Uses:Electrical Insulation, Greases, Heat Sinks, Housings, Injection Molded Parts, Overmolding
Processing Methods:Injection Molding, Potting
Features:Low Density, Low Density, Low Density

3M™ Boron Nitride Cooling Filler Platelets 009 is a engineered to improve thermal conductivity in polymers while maintaining or improving electrical insulation. Their unique properties make these additives suitable for many thermoplastic, elastomer and thermoset resins used in a wide variety of electrical and electronic applications – including thermal interface materials (TIM), consumer electronics and automotive applications.

Palmer Holland, Inc.XIBOND® 185

Principal:Aurorium - Plastics
Functions:Compatibilizer, Coupling Agent, Surface Modifier, Viscosity Modifier
Processing Methods:Extrusion
Chemical Family:Styrene-Maleic Anhydride (SMA)
Labeling Claims:Allergen-free, Animal Products-free, Asbestos-free, Azo Colorants-free, Azo Dyes-free, Bisphenol A-free, Bisphenol B-free, Bisphenol F-free, Bisphenol S-free, Bisphenol Z-free, Bisphenols-free, Butyl Benzyl Phthalate (BBP)-free, Cadmium-free, Chlorophenol-free, Conflict Minerals-free, DEHP (Diethylhexylphthalate) Free, Decabromodiphenyl ether (decaBDE)-free, Dibutyl Phthalate (DBP)-free, Diisobutyl Phthalate (DIBP)-free, Dimethylfumarate-free, Epoxy Derivatives-free, Formaldehyde-free, Halal Suitable, Halogen-free, Heavy Metal-free, Hexavalent Chromium-free, Kosher Suitable, Latex-free, Lead-free, Mercury-free, Nanomaterials-free, Octabromodiphenyl Ether (OctaBDE)-free, Ozone Non Depleting, Pentachlorophenol-free, Per & Polyfluoroalkyl Substances (PFAS)-free, Perfluorohexane sulfonate (PFHxS)-free, Perfluorooctane Sulfonate (PFOS)-free, Perfluorooctanoic Acid (PFOA)-free, Persistent Organic Pollutants (POP)-free, Polybrominated Biphenyls (PBB)-free, Polybrominated Diphenyl Ethers (PBDEs)-free, Polycyclic Aromatic Hydrocarbons (PAH)-free, Silicone-free

XIBOND® 185 is a reactive additive to improve the blend morphology of polymer blends. This additive is a random copolymer of styrene and maleic anhydride.

Palmer Holland, Inc.XIBOND® 335

Principal:Aurorium - Plastics
Functions:Compatibilizer, Coupling Agent, Surface Modifier, Viscosity Modifier
Processing Methods:Extrusion
Chemical Family:Styrene-Maleic Anhydride (SMA), Styrenics
Labeling Claims:Allergen-free, Animal Products-free, Asbestos-free, Azo Colorants-free, Azo Dyes-free, Bisphenol A-free, Bisphenol B-free, Bisphenol F-free, Bisphenol S-free, Bisphenol Z-free, Bisphenols-free, Butyl Benzyl Phthalate (BBP)-free, Cadmium-free, Chlorophenol-free, Conflict Minerals-free, DEHP (Diethylhexylphthalate) Free, Decabromodiphenyl ether (decaBDE)-free, Dibutyl Phthalate (DBP)-free, Diisobutyl Phthalate (DIBP)-free, Dimethylfumarate-free, Epoxy Derivatives-free, Formaldehyde-free, Halal Suitable, Halogen-free, Heavy Metal-free, Hexavalent Chromium-free, Kosher Suitable, Latex-free, Lead-free, Mercury-free, Nanomaterials-free, Octabromodiphenyl Ether (OctaBDE)-free, Ozone Non Depleting, Pentachlorophenol-free, Per & Polyfluoroalkyl Substances (PFAS)-free, Perfluorohexane sulfonate (PFHxS)-free, Perfluorooctane Sulfonate (PFOS)-free, Perfluorooctanoic Acid (PFOA)-free, Persistent Organic Pollutants (POP)-free, Polybrominated Biphenyls (PBB)-free, Polybrominated Diphenyl Ethers (PBDEs)-free, Polycyclic Aromatic Hydrocarbons (PAH)-free, Silicone-free

XIBOND® 335 is a reactive additive to improve the blend morphology of polymer blends, this additive is a random terpolymer of styrene, maleic anhydride and N-Phenylmaleimide.

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