Products

Hemp Fine Hurd Milled 10 is ideal for absorbent applications and biocomposites.Hemp Fine Hurd Milled 10 is sustainably sourced, rapidly renewable, and expected to be free from dust and foreign materials.

3M™ Boron Nitride Cooling Filler Agglomerates 50M is a versatile ceramic material offering thermal conductivity, temperature stability, chemical resistance, high reflectivity, light weighting and electrical insulation. The structure of layered hexagonal plates provides outstanding lubricating properties and is non-abrasive to tooling.

3M™ Boron Nitride Cooling Filler Agglomerates 250S is a versatile ceramic material offering thermal conductivity, temperature stability, chemical resistance, high reflectivity, lightweighting and electrical insulation. The structure of layered hexagonal plates provides outstanding lubricating properties and is non-abrasive to tooling.

3M™ Boron Nitride Cooling Filler Agglomerates 100 is composed of soft bulk agglomerates of crystalline BN platelets, with a mean particle size ranging from 50 to 80μm. It is ideally suited for potting resins and conformable TIM foils or pads, especially in applications with a thin bond line of 150-200μm.

3M™ Boron Nitride Cooling Filler Agglomerates 50 is a versatile ceramic material offering thermal conductivity, temperature stability, chemical resistance, high reflectivity, lightweighting and electrical insulation. The structure of layered hexagonal plates provides outstanding lubricating properties and is non-abrasive to tooling.

3M™ Boron Nitride Cooling Filler Platelets 003 E is a versatile ceramic material offering thermal conductivity, temperature stability, chemical resistance, high reflectivity, lightweighting and electrical insulation. The structure of layered hexagonal plates provides outstanding lubricating properties and is non-abrasive to tooling.

3M™ Boron Nitride Cooling Filler Platelets 006 is a versatile ceramic material offering thermal conductivity, temperature stability, chemical resistance, high reflectivity, lightweighting and electrical insulation. The structure of layered hexagonal plates provides outstanding lubricating properties and is non-abrasive to tooling.

3M™ Boron Nitride Cooling Filler Platelets 003 is a versatile ceramic material offering thermal conductivity, temperature stability, chemical resistance, high reflectivity, lightweighting and electrical insulation. The structure of layered hexagonal plates provides outstanding lubricating properties and is non-abrasive to tooling.

3M™ Boron Nitride Cooling Filler Platelets 009 is a engineered to improve thermal conductivity in polymers while maintaining or improving electrical insulation. Their unique properties make these additives suitable for many thermoplastic, elastomer and thermoset resins used in a wide variety of electrical and electronic applications – including thermal interface materials (TIM), consumer electronics and automotive applications.

3M™ Boron Nitride Cooling Filler Platelets 007HS is a versatile ceramic material offering thermal conductivity, temperature stability, chemical resistance, high reflectivity, lightweighting and electrical insulation. The structure of layered hexagonal plates provides outstanding lubricating properties and is non-abrasive to tooling.

3M™ Boron Nitride Cooling Filler Flakes 200-3 is a engineered to improve thermal conductivity in polymers while maintaining or improving electrical insulation. Their unique properties make these additives suitable for many thermoplastic, elastomer and thermoset resins used in a wide variety of electrical and electronic applications – including thermal interface materials (TIM), consumer electronics and automotive applications.

3M™ Boron Nitride Cooling Filler Platelets 012 is a versatile ceramic material offering thermal conductivity, temperature stability, chemical resistance, high reflectivity, light weighting and electrical insulation. The structure of layered hexagonal plates provides outstanding lubricating properties and is non-abrasive to tooling.

3M™ Boron Nitride Cooling Filler Flakes 200-15 is a versatile ceramic material offering thermal conductivity, temperature stability, chemical resistance, high reflectivity, lightweighting and electrical insulation. The structure of layered hexagonal plates provides outstanding lubricating properties and is non-abrasive to tooling.

3M™ Boron Nitride Cooling Filler Platelets 003 SF is a versatile ceramic material offering thermal conductivity, temperature stability, chemical resistance, high reflectivity, lightweighting and electrical insulation. The structure of layered hexagonal plates provides outstanding lubricating properties and is non-abrasive to tooling.

3M™ Boron Nitride Cooling Filler Flakes 500-15 is a engineered to improve thermal conductivity in polymers while maintaining or improving electrical insulation. Their unique properties make these additives suitable for many thermoplastic, elastomer and thermoset resins used in a wide variety of electrical and electronic applications – including thermal interface materials (TIM), consumer electronics and automotive applications.