Products

HFGEL 120-V10 is an organophilic clay for a broad range of polarity organic liquid systems. Belonging to the newest generation of high performing organoclays, it is easy to disperse and does not require a chemical activator in many systems. HFGEL 120-V10 can be added at any point in the manufacturing process.

D.E.R.® 660-B80 Epoxy Resin Solution is a semi-solid reaction product of epichlorohydrin and bisphenol-A dissolved in n-butanol. D.E.R.® 660-B80 Epoxy Resin Solution is an intermediate epoxy equivalent weight epoxy resin dissolved in butanol, and is used mainly in adhesives and protective coatings, or as a modifier for other epoxy resins to improve impact strength, extensibility, and adhesion. This epoxy resin solution can provide the high solids and chemical resistance of liquid epoxy resins combined with the adhesion, flexibility, excellent mechanical properties, and fast cure of higher molecular weight 1-type solid epoxy resin solutions. D.E.R.® 660-B80 Epoxy Resin can form the basis of many two-component coating systems with either polyamine, polyamide or polyamidoamine curing agents to provide high quality coatings which are resistant to a number of chemical reagents. D.E.R.® 660-B80 Epoxy Resin Solution is ideal for adhesives and medium to heavy duty coatings such as those used for ship hulls, marine paints, tank linings, and industrial maintenance coatings.

DzBh Baling® SIS YH-1106 is a linear styrene/isoprene block copolymer.

DERTOPHENE® T 105 is a light-colored and low VOC terpene phenolic resin. It allows to improve the properties of hot melt or solvent based adhesives such as specific adhesion, hot tack or flexibility.

EVATANE® 33-400 is a random ethylene-vinyl acetate copolymer.

CIMTALC® 10 is produced from high purity ore, which provide low iron content, low surface area and excellent color in dry form as well as when incorporated with resins. CIMTALC® 10 is primarily used in performance polypropylene, where improved tensile strength, flexural modulus, heat distortion temperature, increased stiffness, reduced shrinkage, and lower compounding costs are required. CIMTALC® 10 is platy, hydrophobic, non-abrasive and chemically inert.

CRAYVALLAC® SLT is a high performance micronised amide wax rheology modifier designed for activation-free manufacture of moisture curing methoxysilane based systems. Simple stirring is only necessary to get full efficiency. CRAYVALLAC® SLT is also suitable for the activation-free manufacture of moisture curing methoxysilane based adhesives. CRAYVALLAC® SLT is specially designed for the low temperature manufacture of one-component methoxysilane sealants where processing temperatures typically lie within the range 30 – 80°C. CRAYVALLAC® SLT particles are converted to an interacting network of crystalline fibres. It is this network that gives rise to the shear thinning rheology. This shear thinning characteristic provides for a low viscosity at the shear rates associated with application by extrusion, and a veryhigh viscosity under the low shear rates experienced after application. The net result is ease of application followed by excellent sag and slump resistance.

WWT882191 LIGHT GRAY is a water based resin free.

COPRO® CP-503 is a carboxylated styrene butadiene latex.

SUKOREZ® SU-640 is water white cycloaliphatic hydrocarbon resin. The major usage are a modifier in blends with polymers for filmic application and tackifier for EVA, SIS, SEBS block copolymers, metallo- cene polyolefins and APAO.

3M™ Boron Nitride Cooling Filler Platelets 003 E is a versatile ceramic material offering thermal conductivity, temperature stability, chemical resistance, high reflectivity, lightweighting and electrical insulation. The structure of layered hexagonal plates provides outstanding lubricating properties and is non-abrasive to tooling.

K-FLEX® DP is dipropylene glycol dibenzoate, which is one of the oldest members of the benzoate plasticizer family and one of the most versatile polar, high solvating plasticizers still commercially available. K-FLEX® DP is compatible with a wide range of polar polymers and rubbers and is often blended with other plasticizers such as K-FLEX® DP (diethylene glycol dibenzoate).

3M™ Boron Nitride Cooling Filler Platelets 006 is a versatile ceramic material offering thermal conductivity, temperature stability, chemical resistance, high reflectivity, lightweighting and electrical insulation. The structure of layered hexagonal plates provides outstanding lubricating properties and is non-abrasive to tooling.

DERTOLINE® PLS is a deodorized and highly stabilized rosin esterified with pentaerythritol. It is a tackifying resin mainly suitable for hot melt adhesives based on EVA or styrene block copolymers.