Products

D.E.R.® 3401 is a low viscosity rapidly reacting bisphenol a/f epoxy resin designed for fast-curing coatings, adhesives, and mortars.

D.E.R.® 916 Epoxy Resin is a modified, semi-solid, epoxy novolac resin emulsified in water.

D.E.N.® 424 is used in protective coatings and functions as a binder, resin, and matrix material in CASE ingredients and composite materials.

D.E.H.® 39 Epoxy Curing Agent is a liquid cycloaliphatic polyamine curing agent. D.E.H.® 39 Resin is a low viscosity aliphatic polyamine based on aminoethylpiperazine (AEP). D.E.H.® 39 Curing Agent provides a short pot-life and cures in minutes with liquid epoxy resins. Similar in application to D.E.H. 20, 24, 26 and 29 Epoxy Curing Agents, D.E.H.® 39 Curing Agent is used for maintenance paints, the manufacture of epoxy-amine adducts, in adhesives, civil engineering applications and as an accelerator for polyamide curing agents. In electrical applications, D.E.H.® 39 Curing Agent is used for casting, potting and encapsulation. D.E.H.® 39 Curing Agent is often used for epoxy composite materials.

AP 1001 LV is a low viscosity, reactive, mannich-based amine hardener for epoxy resins based lacquers and coatings.

AEROSIL® R 812 is a fumed silica after-treated with organosilane (HDMDS) with high specific surface and marked hydrophobia.

HFGEL 120-X is an organoclay for solvent-based systems of low to medium polarity.

D.E.N.® 438-MAK80 is a solution of a semi-solid reaction product of epichlorohydrin and phenol-formaldehyde novolac in methyl n-amyl ketone.

D.E.R.® 661 is a standard, low molecular weight, solid epoxy resin designed for use in applications where cure must be achieved at room temperature. D.E.R.® 661 Solid Epoxy Resin can be formulated in solution to yield an excellent base for the formulation of high quality chemical resistant coatings, when cured with polyamine or polyamide curing agents. D.E.R.® 661 Solid Epoxy Resin is also widely used for glass sizing applications. D.E.R.® 661 Epoxy Resin is available in various solutions, e.g. under the designation D.E.R. 671-X75 Epoxy Resin Solution, a solution in xylene (75 wt%). The change in designation from D.E.R.® Epoxy Resin to D.E.R.® 671 Epoxy Resin in this designation reflects the slight difference in epoxy equivalent range in the solution form. D.E.R.® 661 Solid Epoxy Resin can also be used as a complimentary epoxy resin in non-epoxy coating systems to improve resistance properties.

D.E.R.® 727 Epoxy Diluent is a p-tert.-butyl-phenyl glycidyl ether based reactive diluent.

HFGEL 120-V10 is an organophilic clay for a broad range of polarity organic liquid systems. Belonging to the newest generation of high performing organoclays, it is easy to disperse and does not require a chemical activator in many systems. HFGEL 120-V10 can be added at any point in the manufacturing process.

SILIKOPON® EF is a binder and resin used in 2K coatings, protective coatings, solventborne coatings, and solventless and high solids coatings. It provides color retention and good gloss retention.

D.E.N.® 438L is a semi-solid reaction product of epichlorohydrin and phenol-formaldehyde novolac.

HFGEL 120-B is an organophilic clay designed for use primarily in aliphatic and aromatic hydrocarbon systems such as mineral spirits, naptha, xylene and toluene. It is also suitable for some higher polarity solvent systems. HFGEL 120-B can be incorporated at any point in the manufacturing process using common processing equipment.

Epoxy Hardener - AP 5501 is a low viscosity, reactive poly amido amine hardener for epoxy resins based lacquers and coatings.