BONDERITE® L-FG LS 2127

BONDERITE® L-FG LS 2127 is a water-based carrier product. It is used in brazed fabrications, drilling applications, and welds, and is compatible with non-ferrous alloys. The product offers several key features, including anti-adhesion and anti-stick properties, excellent mold release, high temperature performance, increased die and mold life, and non-reactivity, making it suitable for enhancing performance in various industrial applications.

Principal: Henkel Corp

Features: Anti-Adhesion Properties, Anti-Stick Properties, Excellent Mold Release, High Temperature Performance, Increased Die Life, Increased Mold Life, Non-Reactive

Application Area: Brazed Fabrications, Drilling Applications, Welds

Compatible Substrates & Surfaces: Non-Ferrous Alloys

Chemical Family: Chemical Mixtures & Blends

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Enhanced TDS