Products

3M™ Boron Nitride Cooling Filler Platelets 0075 is a versatile ceramic material offering thermal conductivity, temperature stability, chemical resistance, high reflectivity, lightweighting and electrical insulation. The structure of layered hexagonal plates provides outstanding lubricating properties and is non-abrasive to tooling.

3M™ Boron Nitride Cooling Filler Platelets 009 is a engineered to improve thermal conductivity in polymers while maintaining or improving electrical insulation. Their unique properties make these additives suitable for many thermoplastic, elastomer and thermoset resins used in a wide variety of electrical and electronic applications – including thermal interface materials (TIM), consumer electronics and automotive applications.

3M™ Boron Nitride Cooling Filler Flakes 200-3 is a engineered to improve thermal conductivity in polymers while maintaining or improving electrical insulation. Their unique properties make these additives suitable for many thermoplastic, elastomer and thermoset resins used in a wide variety of electrical and electronic applications including thermal interface materials (TIM), consumer electronics and automotive applications.

3M™ Boron Nitride Cooling Filler Platelets 001 is engineered to improve thermal conductivity in polymers while maintaining or improving electrical insulation. Their unique properties make these additives suitable for many thermoplastic, elastomer and thermoset resins used in a wide variety of electrical and electronic applications – including thermal interface materials (TIM), consumer electronics and automotive applications.

3M™ Boron Nitride Cooling Filler Platelets 003 E is a versatile ceramic material offering thermal conductivity, temperature stability, chemical resistance, high reflectivity, lightweighting and electrical insulation. The structure of layered hexagonal plates provides outstanding lubricating properties and is non-abrasive to tooling.

3M™ Boron Nitride Cooling Filler Flakes 200-15 is a versatile ceramic material offering thermal conductivity, temperature stability, chemical resistance, high reflectivity, lightweighting and electrical insulation. The structure of layered hexagonal plates provides outstanding lubricating properties and is non-abrasive to tooling.

3M™ Boron Nitride Cooling Filler Platelets 007HS is a versatile ceramic material offering thermal conductivity, temperature stability, chemical resistance, high reflectivity, lightweighting and electrical insulation. The structure of layered hexagonal plates provides outstanding lubricating properties and is non-abrasive to tooling.

3M™ Boron Nitride Cooling Filler Platelets 006 is a versatile ceramic material offering thermal conductivity, temperature stability, chemical resistance, high reflectivity, lightweighting and electrical insulation. The structure of layered hexagonal plates provides outstanding lubricating properties and is non-abrasive to tooling.

Delamine Tetraethylenepentamine is used in chemical synthesis and electroplating processes and is compatible with epoxies (EP). It serves as an intermediate and curing agent in base chemicals and CASE ingredients. Its applications include gasoline, metal working fluids, and wood preservatives. The product functions as an intermediate, corrosion inhibitor, solvent, processing aid, and curing agent.

Piperazine Pip (100% flakes) is used as an intermediate in chemical synthesis for base chemicals applications.

3M™ Boron Nitride Cooling Filler Flakes 500-3 is a versatile ceramic material offering thermal conductivity, temperature stability, chemical resistance, high reflectivity, lightweighting and electrical insulation. The structure of layered hexagonal plates provides outstanding lubricating properties and is non-abrasive to tooling

3M™ Boron Nitride Cooling Filler Platelets 003 is a versatile ceramic material offering thermal conductivity, temperature stability, chemical resistance, high reflectivity, lightweighting and electrical insulation. The structure of layered hexagonal plates provides outstanding lubricating properties and is non-abrasive to tooling.

DERTOPOLINE® G is a polymerized rosin esterified with glycerol, is a high softening-point tackifier resin recommended for Hot Melt adhesives and for masterbatch formulations.