- Principal:Henkel Corp
- Features:Anti-Adhesion Properties, Anti-Stick Properties, Excellent Mold Release, High Temperature Performance, Increased Die Life, Increased Mold Life, Non-Reactive
- Application Area:Brazed Fabrications, Drilling Applications, Welds
- Compatible Substrates & Surfaces:Non-Ferrous Alloys
- Chemical Family:Chemical Mixtures & Blends
BONDERITE® L-FG LS 2127 is a water-based carrier product. It is used in brazed fabrications, drilling applications, and welds, and is compatible with non-ferrous alloys. The product offers several key features, including anti-adhesion and anti-stick properties, excellent mold release, high temperature performance, increased die and mold life, and non-reactivity, making it suitable for enhancing performance in various industrial applications.