3M™ Boron Nitride Cooling Filler Flakes 500-15

3M™ Boron Nitride Cooling Filler Flakes 500-15 is a engineered to improve thermal conductivity in polymers while maintaining or improving electrical insulation. Their unique properties make these additives suitable for many thermoplastic, elastomer and thermoset resins used in a wide variety of electrical and electronic applications including thermal interface materials (TIM), consumer electronics and automotive applications.

Principal: 3M Advanced Materials

Functions: Filler, Filler, Filler, Intermediate

Chemical Name: Boron Nitride

Chemical Family: Nitrides

End Uses: Electrical Insulation, Greases, Housings

Features: Good Thermal Conductivity, High Thermal Conductivity

Enhanced TDS

Identification & Functionality

Features & Benefits

CASE Ingredients Features
Fluids & Lubricants Features
Materials Features
Product Benefits

3M™ Boron Nitride is a versatile ceramic material offering thermal conductivity, temperature stability, chemical resistance, high reflectivity, lightweighting and electrical insulation. The structure of layered hexagonal plates provides outstanding lubricating properties and is non-abrasive to tooling.

Product Benefits

3M™ Technical Ceramics Offers a family of Boron nitride cooling filler materials:

  • 3M™ Boron Nitride Cooling Filler Platelets: Powders of highly crystalline single platelets.
  • 3M™ Boron Nitride Cooling Filler Agglomerates (experimental product): Soft, randomly oriented aggregated platelets.
  • 3M™ Boron Nitride Cooling Filler Flakes 500-15: Hard, oriented aggregated platelets.
  • 3M™ Boron Nitride is a versatile ceramic material offering thermal conductivity, temperature stability, chemical resistance, high reflectivity, lightweighting and electrical insulation. The structure of layered hexagonal plates provides outstanding lubricating properties and is non-abrasive to tooling.
Product Features
  • Excellent heat spreading.
  • Excellent heat transfer.
  • Ideal as secondary filler to boost thermal conductivity.
  • Maintains high thermal conductivity under high-shear compounding.
  • Optimized through-plane thermal conductivity

Applications & Uses

Fluids & Lubricants End Use
Fluids & Lubricants Type
Plastics & Elastomers End Uses
Markets
Applications
Processing Information

Factors such as melt temperature, compounding technique, injection rate and more can have a significant effect on the thermal and electrical insulative properties of parts made with boron nitride cooling fillers.

Properties

Physical Form

Regulatory & Compliance

Technical Details & Test Data

Technical Data

3M™ Boron Nitride Cooling Filler Flakes CFF 500-15

Preferred for lowest viscosity in epoxies and silicones. High thermal conductivity.

Packaging & Availability

Packaging Type

Principal Information

Group Principal Number
S002409
Principal

Other

Color (SDS)
White
Item Number
Odor (SDS)
Odorless
Temperature Control
No
USA/DOT UN Number
Not Applicable
Chemical Properties
ValueUnitsTest Method / Conditions
Active Oxygen Contentmax. 0.7 %%
Material Composition
ValueUnitsTest Method / Conditions
Boron Nitride Contentmin. 98.5 %%
Boron Trioxide Contentmax. 0.1 %%
Carbon Contentmax. 0.2 %%
Physical Properties
ValueUnitsTest Method / Conditions
Bulk Density0.5-0.7 g/cm³g/cm³DIN Method
Bulk Density0.5-0.7 g/cm³g/cm³ISO 23145-2
Particle Size20.0-150.0 µmµmLaser Light Scattering d(0.1), mastersizer 2000, dry, 0.1 bardispersion in ethanol
Particle Size160.0-400.0 µmµmLaser Light Scattering d 0.5, mastersizer 2000, dry, 0.1 bar, dispersion in ethanol
Specific Surface Areamax. 3.0 m²/gm²/g
SDS Physical and Chemical Properties
ValueUnitsTest Method / Conditions
Bulk Density (SDS)50.0-550.0-
Decomposition Temperature (SDS)2730.0 °C°C
Density (SDS)2.25 g/cm³g/cm³at 20°C
Solubility In Water (SDS)max. 0.000162 g/Lg/L
Shelf Life & Stability
ValueUnitsTest Method / Conditions
Shelf Life0.0-