Products

3M™ Glass Bubbles HGS4000 is used for drilling and cementing across highly depleted zones and weaker formations, low-density systems are required to prevent/minimize problems associated with excessive overbalance conditions including fluid loss and lost circulation, differential sticking, minimal penetration rates, formation damage, and reduced well productivity.

3M™ Glass Bubbles HGS4K28, when drilling and cementing across highly depleted zones and weaker formations, low-density systems are required to prevent and minimize problems associated with excessive overbalance conditions including fluid loss, lost circulation, differential sticking, minimal penetration rates, formation damage, and reduced well productivity.

3M™ Boron Nitride Cooling Filler Flakes 200-15 is a versatile ceramic material offering thermal conductivity, temperature stability, chemical resistance, high reflectivity, lightweighting and electrical insulation. The structure of layered hexagonal plates provides outstanding lubricating properties and is non-abrasive to tooling.

3M™ Glass Bubbless H50/10000 are engineered hollow glass microspheres that are alternatives to conventional fillers and additives such as silicas, calcium carbonate, talc, clay, ctc., for many demanding applications. These low-density particles are used in a wide range of industrics to reduce part weight, lower costs and enhance product properties. The spherical shape of 3M™ Glass Bubbles Types H50/10000 offers a number of important benefits, including: higher filler loading, lower viscosity, improved flow, and reduced shrinkage and warpage. It also helps the 3M glass bubbles blend readily into compounds, and makes them adaptable to a varicty of production processes, including spraying, casting and molding. In addition, they offer greater survivability under demanding processing conditions, such as injection molding, and also produce stable voids, which results in low thermal conductivity and a low dielectric constant. The chemically stable soda-lime-borosilicate glass composition of 3M™ Glass Bubbles Types H50/10000 provides excellent water resistance, to create more stable emulsions. They are also non-combustible and non-porous, so they do not absorb resin. And, their low alkalinity gives 3M™ Glass Bubbles Types H50/10000 compatibility with most resins, stable viscosity and long shelf life.

AP 5805 is an undiluted clear bifunctional liquid epoxy resin produced from bisphenol A and epichlorohydrin.

3M™ Boron Nitride Cooling Filler Platelets 012 P is a powders of highly crystalline boron nitride single platelets. Particle mean size ranges from 0.5 to 14 μm.

3M™ Glass Bubbles S38HS are high-strength polymer additives made from a water-resistant and chemically-stable soda-lime-borosilicate glass. These glass bubbles are designed for buoyancy and insulation in ultra-deep water applications in oil and gas drilling.The bubbles produce strong, stable voids and low thermal conductivity, helping coatings achieve the necessary compressive strength.

BONDERITE® S-FN GP 1904 is a dispersion of PTFE and graphite in a thermosetting binder designed to be applied by spray, brush, or dip. BONDERITE® S-FN GP 1904 produces a low friction coating with excellent resistance to corrosion and solvents. The wide range of cure temperatures 149 to 260°C allows BONDERITE® S-FN GP 1904 to be used on wood, rubber and many plastics and on engineering metals. BONDERITE® S-FN GP 1904 is a one-package product and is not affected by low temperature storage conditions.

3M™ Boron Nitride Cooling Filler Platelets 003 SF is a versatile ceramic material offering thermal conductivity, temperature stability, chemical resistance, high reflectivity, lightweighting and electrical insulation. The structure of layered hexagonal plates provides outstanding lubricating properties and is non-abrasive to tooling.

OREVAC® 18343 is a maleic anhydride grafted linear low density polyethylene. OREVAC® 18343 has been designed to develop a reliable bonding strength between polyethylene or ethylene copolymers and mineral fillers such as aluminum trihydrate (ATH) or magnesium hydroxide (MDH). It is an effective coupling agent for halogen- free flame retardant (HFFR) compounds using high loadings of mineral fillers, such as compounds for insulation and sheathing of wires and cables.

3M™ Glass Bubbles S42XHS-OG-ES-1 are high-strength polymer additives made from a water-resistant and chemically-stable soda-lime borosilicate glass. 3M glass bubbles S42XHS-OG-ES-1 have been treated with a proprietary silane coupling agent for use in applications with unsaturated Polyesters, Acrylics, EVA and Polyolefins. These hollow glass microspheres can be used as a low density filler material ideal for liquid thermoset as well as thermoplastic and rubber parts created from molding, extrusion processes, and/or other vigorous processing equipment (e.g., Banbury mixers, etc.), offering improved processing over many conventional fillers. 3M glass bubbles S42XHS-OG-ES-1 may help to reduce weight, improve dimensional stability, reduce shrinkage and sink marks, and contribute to material and process cost savings. They may be ideal additive materials for applications in the automotive, heavy truck, aerospace, electrical, sports and leisure, electronics, appliance and durable goods industries, as well as in construction products such as polymer, wood composites and siding helping not only to reduce part weight, but also to improve dimensional stability.

3M™ Glass Bubbles HGS5000 is a filler used in aerospace syntactic foam, cement slurry, hydrospace syntactic foam, and oil & gas applications. It is also utilized in printed wire boards and radomes within plastics and elastomers applications.

3M™ Boron Nitride Cooling Filler Platelets 009 is a engineered to improve thermal conductivity in polymers while maintaining or improving electrical insulation. Their unique properties make these additives suitable for many thermoplastic, elastomer and thermoset resins used in a wide variety of electrical and electronic applications – including thermal interface materials (TIM), consumer electronics and automotive applications.

3M™ Boron Nitride Cooling Fillers 003SF are engineered to improve thermal conductivity in polymers while maintaining or improving electrical insulation. Their unique properties make these additives suitable for many thermoplastic, elastomer and thermoset resins used in a wide variety of electrical and electronic applications – including thermal interface materials (TIM), consumer electronics and automotive applications.